BGA Unloading Machine

Features

     PLC control, touch screen control, standard SMEMA signal port.

     The linear module adds servo control to lift and translate.

     The board retracting method adopts motor plus thrust overload protection to ensure that the BGA board will not be damaged.

     The frame replacement method is manual replacement.


Description

It is mainly used for semiconductor packaging testing. The BGA board is transferred to the back-end equipment through the storage method of the material frame (magazine clip), and has an automatic collecting function.

Specifications

model

Machine size (mm)

length*width*height

Maximum size of material frame

PCB conveying height

weight

(About)

CBLD-1000C

870*700*1200

280*105*280mm

900±20mm

225KG