On October 15, 2026, the CEIA Electronics Manufacturing "Advanced Packaging & Smart Manufacturing Innovation Forum" was held in Beijing. Suzhou Conber Electronic Equipment Co., Ltd. appeared as a sponsor brand alongside hundreds of industry professionals from chip design, packaging & testing, assembly, and final equipment manufacturing sectors to explore new trends in AI-driven electronics manufacturing.

The forum focused on AI empowerment, advanced packaging, and smart manufacturing, attracting over 300 professionals and featuring 41 domestic and international brands. At the brand exhibition area, CONBER presented its technological achievements in SMT smart manufacturing solutions. With robust quality and professional service, it drew widespread attention from engineers and procurement specialists on-site, and through the forum's matchmaking sessions, established in-depth exchanges with multiple enterprises.

As a Suzhou-based electronic equipment manufacturer, CONBER has always been dedicated to the intelligent upgrade of electronics production lines: building a complete product matrix around SMT peripheral equipment—covering board loading, conveying, interfacing, and unloading—and extending into intelligent warehouse systems and AGV logistics solutions. This provides electronics manufacturers with end-to-end automation solutions spanning material management to line logistics, helping customers reduce headcount, improve efficiency, and achieve flexible production.

Looking ahead, CONBER will continue to uphold its quality foundation of "self-developed technology, self-controlled production lines," integrate AI concepts into equipment R&D and service models, continuously optimize intelligent warehouse scheduling and AGV path planning capabilities, collaborate with industry partners for joint innovation, and jointly propel China's electronics manufacturing toward becoming a global smart manufacturing powerhouse.